Features

Self-Etched Dentin: 30.4 MPa
Self-Etched Enamel: 25.4 MPa
Etched Enamel: 30.3 MPa

8th Gen Self-Etch Light Cure Adhesive
Versatile: Total, Selective, Self-Etch Compatibility
High Bonding Strength: Dentin, Enamel, Metal
Deep Penetration, Low Film Thickness
Microleakage Prevention, Reduced Post-op Sensitivity
Easy Application, Excellent Biocompatibility

Descriptions

Vincismile’s HugeBond Universal Light Cure Bonding Agent represents the latest generation of dental adhesives, offering exceptional versatility and performance. This one-component, self-etch adhesive is compatible with total-etch and selective-etch techniques, making it suitable for a wide range of restorative applications. With high bonding strength exceeding 20MPa, it effortlessly bonds to various surfaces including enamel, dentin, composite resin, metal, and oxide full-ceramic surfaces like zirconia and alumina. Its strong permeability ensures deep penetration into dentin tubules, forming a robust bond that reduces microleakage, prevents secondary caries, and minimizes post-operative sensitivity. Additionally, its easy-to-use nature, low film thickness, and compatibility with light-cured, self-cured, and dual-cured cements make it an indispensable choice for direct and indirect restorations, orthodontic bands cementation, and dental repairs with light-cured composite resins or resin cements.

Specifications

Generation: 8th Generation
Type: One-component, Self-etch Light Cure Adhesive
Compatibility: Total-Etch, Selective-Etch, Light-Cured, Self-Cured, Dual-Cured
Surfaces Compatible: Enamel, Dentin, Composite Resin, Metal, Zirconia, Alumina, Oxide Full-Ceramic
Permeability: Strong Permeability for Deep Dentin Tubule Penetration
Film Thickness: Low
Microleakage Prevention: Yes, Reduces Secondary Caries and Post-operative Sensitivity
Applications: Direct Bonding, Cementation, Repair of Restorations, Resin Cement Usage
Biocompatibility: Excellent Biocompatibility
Ease of Use: Easy-to-Use