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The light-curing bonding agent Heliobond optimizes the enamel etching procedure in conjunction with all light-curing restorative materials.

Indications

  • Adhesive for enamel bonding
  • Together with Syntac also dentin bonding agent
  • Cementation of tooth jewelry, e.g. Skyce
  • Transparent sealing of fissures and restorations
  • As a bonding layer for the repair of composite, crown and bridge restorations

Features

  • For optimum marginal seal between tooth and composite, when applied in conjunction with the enamel-etch technique.
  • Storage at room temperature

Key Specifications

Composition

Heliobond contains: Bis-GMA 60 %wt. Triethylene glycol dimethacrylate 40 %wt

  • Storage at room temperature
  • Optimum marginal seal between tooth & composite
  • Adhesive for enamel bonding
  • Cementation of tooth jewelry, e.g. Skyce

Packaging

  • 1 x 6gm Bottle

Directions to Use

1. Bonding agent for adhesive restorations

  • Etch desired enamel surfaces (see preparation of the enamel). If necessary, cover exposed dentin surfaces with Syntac Adhesive (see Syntac instructions for use) or appropriate base material.
  • Apply a thin layer of Heliobond onto the etched enamel surface using a brush or spherical instrument.
  • An optimal, thin layer can be achieved using a stream of air.
  • If used in combination with light-curing luting composites, Heliobond does not require separate polymerization. For direct restorations, separate polymerization of Heliobond is required: Light-cure for 10 s using a light intensity of 500 to 1100 mW/cm2 (e.g. Bluephase).
  • Application of the composite.
  • Polymerization of the composite.
  • Finishing of the restoration.

2. Transparent sealant for fissures and pits

  • Etch desired enamel surfaces (see preparation of the enamel).
  • Apply Heliobond into the fissures using a suitable instrument or brush. Avoid entrapment of air and wait for approx. 15 s to allow penetration.
  • Polymerize with light for 20 s using a light intensity of 500 to 1100 mW/cm2 (e.g. Bluephase).
  • After curing, remove inhibited layer. Check occlusion and grind off any excess material.

3. Preparation of resin repair work

  • Roughen the smooth resin surfaces.
  • If necessary, apply Monobond® Plus (see Monobond Plus instructions for use).
  • Apply a thin layer of Heliobond (use a stream of air, if necessary).
  • Polymerize with light for 10 s using a light intensity of 500 to 1100 mW/cm2 (e.g. Bluephase).

Additional information

Weight0.750 kg

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