Features

Supports both etch-and-rinse and selective-etch techniques
Strong adhesion to both enamel and dentin
Provides long-lasting bonding strength for durable restorations
Ideal for use with light-cured composites in direct restorations
Streamlined application process for efficient workflow
Minimizes risk of microleakage and restoration failure
Smooth consistency allows easy and uniform application
Packaged in a convenient 5ml bottle

Description

DPI Curex Bond 5G Dental Adhesive is a 5th generation adhesive system engineered for superior performance in restorative dentistry. It supports both etch-and-rinse and enamel selective-etch techniques, offering clinicians the flexibility to tailor bonding protocols to specific cases. Designed for direct restorations using light-cured composites, it ensures strong and durable bonds to both enamel and dentin. Its advanced formulation delivers long-lasting adhesion and optimal handling, streamlining the restorative workflow. Ideal for everyday clinical procedures, this adhesive simplifies the bonding process while ensuring high bond strength, reduced microleakage, and improved restoration longevity. DPI Curex Bond 5G is the go-to choice for reliable, easy-to-use bonding in modern adhesive dentistry.

Key Specifications

Generation: 5th generation
Bonding Type: Etch-and-rinse/selective-etch
Indication: Direct restorations
Curing Compatibility: Light-cured composites
Substrate Use: Enamel and dentin
Bond Strength: Long-lasting adhesion
Handling: Smooth application
Packaging: 5ml bottle

Packaging

DPI Curex Bond 5G Dental Adhesive

5 ml

Direction to Use

Preparation:

Isolate the tooth and clean the preparation area thoroughly.
Choose bonding technique: etch-and-rinse or selective-etch.

Etching:

Apply phosphoric acid etchant for 15–20 seconds to enamel (and dentin if etch-and-rinse).
Rinse thoroughly and gently air-dry—avoid overdrying the dentin.

Bond Application: